Showing 1 - 4 of 4

1

Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique
LEE, W. S ; HAN, I. Y ; JIN YU ; et al.
6th symposium of the Korean Society of thermophysical propertiesThermochimica acta. 455(1-2):148-155

General chemistry, physi... Chimie générale, chimie... Metallurgy, welding Métallurgie, soudage Sciences exactes et tech... Exact sciences and techn...
Conference
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2

Diode temperature sensor array for measuring micro-scale surface temperatures with high resolution
Han, IY Han, Il Young ; Kim, SJ Kim, SungJin
Sensors and Actuators A: Physical. 141:52-58

Micro-scale temperature... Diode temperature sensor... Diode sensor 02 engineering and techn... 0210 nano-technology 01 natural sciences
Academic journal
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3

Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique
Lee W.S. ; Byun K.Y. ; Han I.Y. ; et al.
Thermochimica Acta. 455:148-155

Diode temperature sensor... 0103 physical sciences Flip-chip package 02 engineering and techn... Diamond 0210 nano-technology
Academic journal
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4

Study on the heat transfer phenomena for flow and temperature sensors ; 유량 및 온도 센서 내의 열전달 현상에 관한 연구
Han, Il-Young ; 한일영 ; Kim, Sung-Jin ; et al.

Flow Sensor Diode Temperature Sensor... Mass Flow Controller Temperatue Sensor 고집적 온도센서 유량 센서
Dissertation/ Thesis
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