• Suche: "Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices"

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141

Thickness tolerance compensation of SIL first surface near-field recording with replicated lens on SIL
YOON, Yong-Joong ; CHOI, Hyun ; KIM, Wan-Chin ; et al.
ASME/ISPS/JSME-IIP Joint conference on micromechatronics for information and precision equipment, Santa Clara, California, USA, 2006Microsystem technologies. 13(8-10):1289-1295

Electronics Electronique Mechanical engineering Génie mécanique Metrology and instrument... Métrologie et instrument... …
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142

Thickness induced superconducting insulating transition in Nd1.2Ba1.8Cu3Oz ultra-thin films
SALLUZZO, M ; DE LUCA, G. M ; VAGLIO, R
The 2006 applied superconductivity conference, Seattle, WA, August 27-September 1, 2006. Part III of three partsIEEE transactions on applied superconductivity. 17(2):3569-3572

Electronics Electronique Electrical engineering Electrotechnique Sciences exactes et tech... Exact sciences and techn... …
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143

Thickness dependence of ti buffer layers for fabricating As-grown MgB2 films
HARADA, Yoshitomo ; YAMAGUCHI, Hirotaka ; TAKAHASHI, Terukazu ; et al.
The 2006 applied superconductivity conference, Seattle, WA, August 27-September 1, 2006. Part III of three partsIEEE transactions on applied superconductivity. 17(2):2883-2886

Electronics Electronique Electrical engineering Electrotechnique Sciences exactes et tech... Exact sciences and techn... …
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144

Thermomechanical response of membrane-like MEMS component
DRZIK, M ; CHLPFK, J ; LALINSKY, T
Proceedings of the 32nd International Conference on Micro- and Nano-Engineering, Barcelona, 17-20 September 2006Microelectronic engineering. 84(5-8):1274-1277

Electronics Electronique Sciences exactes et tech... Exact sciences and techn... Sciences appliquees Applied sciences …
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145

Thermoelectric properties and thermoelectric devices of free-standing GaN and epitaxial GaN layer
KAIWA, N ; HOSHINO, M ; YAGINUMA, T ; et al.
Proceedings of the Third International Conference on Materials for Advanced Technologies (ICMAT 2005) Symposium J: III-V Semiconductors for Microelectronic and Optoelectronic Applications, Singapore, July 3-8, 2005Thin solid films. 515(10):4501-4504

Crystallography Cristallographie cristal... Electronics Electronique Metallurgy, welding Métallurgie, soudage …
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146

Thermo-mechanical evolution of multilayer thin films: Part I. Mechanical behavior of Au/Cr/Si microcantilevers
MILLER, David C ; HERRMANN, Cari F ; MAIER, Hans J ; et al.
Proceedings of the TMS Symposium - Mechanical Behaviour of Thin Films and Small Structures, San Francisco, California, February 13-17, 2005Thin solid films. 515(6):3208-3223

Crystallography Cristallographie cristal... Electronics Electronique Metallurgy, welding Métallurgie, soudage …
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147

Thermally assisted transition in thin film based FCL : A way to speed up the normal transition across the wafer
ANTOGNAZZA, L ; DECROUX, M ; THERASSE, M ; et al.
The 2006 applied superconductivity conference, Seattle, WA, August 27-September 1, 2006. Part III of three partsIEEE transactions on applied superconductivity. 17(2):3463-3466

Electronics Electronique Electrical engineering Electrotechnique Sciences exactes et tech... Exact sciences and techn... …
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148

Thermal-stability improvement of LaON thin film formed using nitrogen radicals
SATO, S ; TACHI, K ; KAKUSHIMA, K ; et al.
INFOS 2007: Proceedings of the 15th Biennial Conference on Insulating Films on Semiconductors, June 20-23, 2007, Glyfada Athens, GreeceMicroelectronic engineering. 84(9-10):1894-1897

Electronics Electronique Sciences exactes et tech... Exact sciences and techn... Sciences appliquees Applied sciences …
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149

Thermal treatment for optical proximity correction
KIM, Sang-Kon
Proceedings of the 32nd International Conference on Micro- and Nano-Engineering, Barcelona, 17-20 September 2006Microelectronic engineering. 84(5-8):766-769

Electronics Electronique Sciences exactes et tech... Exact sciences and techn... Sciences appliquees Applied sciences …
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150

Thermal stability of Ti/Pt/Au ohmic contacts for cryogenically cooled InP-based HEMTs on (41 1)A-oriented substrates by MBE
WATANABE, Issei ; SHINOHARA, Keisuke ; KITADA, Takahiro ; et al.
14th International Conference on Molecular Beam Epitaxy (MBE-XIV), 3-8 September 2006, Tokyo, JapanJournal of crystal growth. 301-302:1025-1029

Crystallography Cristallographie cristal... Geology Géologie Metallurgy, welding Métallurgie, soudage …
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151

Thermal runaway characteristics of Bi2212 coil for conduction-cooled SMES
KOJIMA, Hiroki ; HAYAKAWA, Naoki ; NOGUCHI, Shinki ; et al.
The 2006 applied superconductivity conference, Seattle, WA, August 27-September 1, 2006. Part II of three partsIEEE transactions on applied superconductivity. 17(2):1959-1962

Electronics Electronique Electrical engineering Electrotechnique Sciences exactes et tech... Exact sciences and techn... …
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152

Thermal simulation of UV laser ablation of polyimide : Polytronic 2005
GORDON, Péter ; BALOGH, Balint ; SINKOVICS, Balint
Microelectronics and reliability. 47(2-3):347-353

Electronics Electronique Sciences exactes et tech... Exact sciences and techn... Sciences appliquees Applied sciences …
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153

Thermal imprint lithography using sub-micron sized nickel template coated with thin SiO2 layer
BYEON, Kyeong-Jae ; YANG, Ki-Yeon ; LEE, Heon
Proceedings of the 32nd International Conference on Micro- and Nano-Engineering, Barcelona, 17-20 September 2006Microelectronic engineering. 84(5-8):1003-1006

Electronics Electronique Sciences exactes et tech... Exact sciences and techn... Sciences appliquees Applied sciences …
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154

Thermal effects on light-emission properties of GaN LEDs grown by metal-organic vapor phase epitaxy
HONDA, Tohru ; KOBAYASHI, Toshiaki ; EGAWA, Shinichi ; et al.
First International Symposium on Growth of Nitrides (ISGN-1), Linköping, 4-7 June 2006Journal of crystal growth. 300(1):90-93

Crystallography Cristallographie cristal... Geology Géologie Metallurgy, welding Métallurgie, soudage …
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155

Thermal cycling reliability of SnAgCu and SnPb solder joints : A comparison for several IC-packages
VANDEVELDE, Bart ; GONZALEZ, Mario ; LIMAYE, Paresh ; et al.
Microelectronics and reliability. 47(2-3):259-265

Electronics Electronique Sciences exactes et tech... Exact sciences and techn... Sciences appliquees Applied sciences …
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156

Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique
LEE, W. S ; HAN, I. Y ; JIN YU ; et al.
6th symposium of the Korean Society of thermophysical propertiesThermochimica acta. 455(1-2):148-155

General chemistry, physi... Chimie générale, chimie... Metallurgy, welding Métallurgie, soudage Sciences exactes et tech... Exact sciences and techn... …
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157

Thermal behavior of floating gate oxide defects (moving bits)
MOUHOUBI, S ; YAO, T ; LALANDE, F ; et al.
SiO2, advanced dielectrics and related devices, Mondelo, Palermo, Italy, June 25-28, 2006Journal of non-crystalline solids. 353(5-7):615-619

Crystallography Cristallographie cristal... Chemical industry parach... Industrie chimique et pa... Metallurgy, welding Métallurgie, soudage …
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158

Thermal and non-thermal saturation effects in the output characteristic of UV-to-violet emitting (AlGaIn)N LEDs
BAEUMLER, M ; KUNZER, M ; SCHMIDT, R ; et al.
Physica status solidi. A, Applications and materials science (Print). 204(4):1018-1024

Crystallography Cristallographie cristal... Electronics Electronique Nanotechnologies, nanost... Nanotechnologies, nanost... …
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159

Thermal analysis of high power GaN-based LEDs with ceramic package
LIANQIAO YANG ; SUNHO JANG ; HWANG, Woongjoon ; et al.
6th symposium of the Korean Society of thermophysical propertiesThermochimica acta. 455(1-2):95-99

General chemistry, physi... Chimie générale, chimie... Metallurgy, welding Métallurgie, soudage Sciences exactes et tech... Exact sciences and techn... …
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160

Thermal analysis of LED array system with heat pipe
KIM, Lan ; JONG HWA CHOI ; SUN HO JANG ; et al.
6th symposium of the Korean Society of thermophysical propertiesThermochimica acta. 455(1-2):21-25

General chemistry, physi... Chimie générale, chimie... Metallurgy, welding Métallurgie, soudage Sciences exactes et tech... Exact sciences and techn... …
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