Showing 1 - 3 of 3

1

Simulation and Reliability Assessment of Advanced Packaging
Chiang, Kuo-Ning

flip-chip package 2.5D package thermal warpage strain gauge electronic packaging dynamic storage modulus
eBook
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2

Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks
Cadmus Yuan ; Qinghua Su ; Kuo-Ning Chiang
Materials (Basel)
Materials; Volume 16; Issue 14; Pages: 4922

0103 physical sciences 02 engineering and techn... Equation-Informed Neural... advanced electronic pack... numerical Bayesian Infer... constitutive equations
Academic journal
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3

馬可夫鏈蒙地卡羅法應用於河川砂礫啟動模式參數不確定性之降低 ; Application of Markov Chain Monte Carlo Methodology to Reduction of Parameter Uncertainty in a Sediment Entrainment Model
陳臻祺 ; Chen, Chen-Chi ; 吳富春 ; et al.

馬可夫鏈蒙地卡羅法... 參數不確定性 數值貝氏推論 Markov Chain Monte Carlo parameter uncertainty numerical Bayesian infer...
Dissertation/ Thesis
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