Treffer: Exploring potential benefits of 3D FPGA integration
Title:
Exploring potential benefits of 3D FPGA integration
Authors:
Source:
FPL 2004 : field-programmable logic and applications (Antwerp, 30 August - 1 September 2004)Lecture notes in computer science. :874-880
Publisher Information:
Berlin: Springer, 2004.
Publication Year:
2004
Physical Description:
print, 13 ref
Original Material:
INIST-CNRS
Subject Terms:
Computer science, Informatique, Mathematics, Mathématiques, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Informatique; automatique theorique; systemes, Computer science; control theory; systems, Logiciel, Software, Traitement des langages et microprogrammation, Language processing and microprogramming, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Circuits intégrés par fonction (dont mémoires et processeurs), Integrated circuits by function (including memories and processors), Architecture reconfigurable, Reconfigurable architectures, Chemin critique, Critical path, Recorrido crítico, Conception circuit, Circuit design, Diseño circuito, Modèle 3 dimensions, Three dimensional model, Modelo 3 dimensiones, Méthode empirique, Empirical method, Método empírico, Retard, Delay, Retraso, Réseau porte programmable, Field programmable gate array, Red puerta programable, Système temporisé, Timed system, Sistema temporizado
Document Type:
Konferenz
Conference Paper
File Description:
text
Language:
English
Author Affiliations:
200 Union St. SE, ECE Department, University of Minnesota, Minneapolis MN 55455, United States
ISSN:
0302-9743
Rights:
Copyright 2004 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Computer science; theoretical automation; systems
Electronics
Electronics
Accession Number:
edscal.16107559
Database:
PASCAL Archive
Weitere Informationen
A new timing-driven partitioning-based placement tool for 3D FPGA integration is presented. The circuit is first divided into layers with limited number of inter-layer vias, and then placement is performed on individual layers, while minimizing the delay of critical paths. We use our tool as a platform for exploring potential benefits in terms of delay and wire-length that 3D technologies can offer for FPGA fabrics. We show that 3D integration results in wire-length reduction for FPGA designs. Our empirical analysis shows that wire-length can be reduced by up to 50% using ten layers. Delay reductions are estimated to be more than 30% if multi-segment lengths are employed between layers.