Treffer: Transient compact modeling for multi chips components
Title:
Transient compact modeling for multi chips components
Authors:
Source:
11th International workshop on thermal investigation of ICs and systems (THERMINIC, Belgirate, Lake Maggiore, Italy, 28-30 September 2005). :129-133
Publisher Information:
Grenoble: TIMA, 2005.
Publication Year:
2005
Physical Description:
print, 4 ref 1
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Comportement thermique, Thermal behavior, Comportamiento térmico, Composant électronique, Electronic component, Componente electrónico, Logiciel, Software, Logicial, Module multipuce, Multichip module, Modulo multipulga, Modèle non linéaire, Non linear model, Modelo no lineal, Modèle thermique, Thermal model, Modelo térmico, Modélisation, Modeling, Modelización, Programme SPICE, SPICE, Simulation électrique, Electrical simulation, Simulación eléctrica
Document Type:
Konferenz
Conference Paper
File Description:
text
Language:
English
Author Affiliations:
LAAS/CNRS, 7 avenue du Colonel Roche, 31077 Toulouse, France
INSA, 135 avenue de Rangueil, 31077 Toulouse, France
INSA, 135 avenue de Rangueil, 31077 Toulouse, France
Rights:
Copyright 2006 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.17624876
Database:
PASCAL Archive
Weitere Informationen
In this paper, we present a methodology to generate transient 3D Nonlinear Compact Thermal Models (CTMs) for multi-chip electronic components and systems. This method is based on defining the Optimal Thermal Coupling Point (OTCP) that simplifies generating the CTMs. The CTMs are presented by RC network that enables us to make full and fast electro-thermal calculations in one simulation process by using PSpice or any electrical simulation software. This paper is a continuity fdr-research work that aims at reducing the number of RC elements, indeed the proposed work differs from nodal method that induce significant number of RC elements, while remaining faithful to the physical phenomena to model.