Treffer: Diode laser soldering using a lead-free filler material for electronic packaging structures
Title:
Diode laser soldering using a lead-free filler material for electronic packaging structures
Authors:
Source:
Proceedings of the European Materials Research Society 2005 - Symposium-J: Advances in Laser and Lamp Processing of Functional Materials, Strasbourg, France, May 31-3 June 2005Applied surface science. 252(13):4406-4410
Publisher Information:
Amsterdam: Elsevier Science, 2006.
Publication Year:
2006
Physical Description:
print, 21 ref
Original Material:
INIST-CNRS
Subject Terms:
General chemistry, physical chemistry, Chimie générale, chimie physique, Crystallography, Cristallographie cristallogenèse, Nanotechnologies, nanostructures, nanoobjects, Nanotechnologies, nanostructures, nanoobjets, Condensed state physics, Physique de l'état condensé, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Generalites, General, Instruments, appareillage, composants et techniques communs à plusieurs branches de la physique et de l'astronomie, Instruments, apparatus, components and techniques common to several branches of physics and astronomy, Informatique en physique expérimentale, Computers in experimental physics, Modélisation et simulation par ordinateur, Computer modeling and simulation, Domaines classiques de la physique (y compris les applications), Fundamental areas of phenomenology (including applications), Optique, Optics, Lasers, Lasers à semiconducteur; diodes laser, Semiconductor lasers; laser diodes, Domaines interdisciplinaires: science des materiaux; rheologie, Cross-disciplinary physics: materials science; rheology, Science des matériaux, Materials science, Autres méthodes de préparation et de traitement des matériaux, Materials synthesis; materials processing, Joining; welding, Brasage tendre, Soldering, Diffusion(transport), Diffusion, Diode laser, Laser diodes, Modélisation, Modelling, Packaging électronique, Electronic packaging, Packaging electrónico, Produit apport, Filler material, Producto aportación, Simulation, 42.55.Px; 81.20.Vj; 07.05.Tp; 68.35.Fx, Laser; Soldering; Lead-free; Thermal modelling; Electronic packaging
Document Type:
Konferenz
Conference Paper
File Description:
text
Language:
English
Author Affiliations:
IREPA LASER, Parc d'innovation, Pôle API, 67400 Illkirch, France
ISSN:
0169-4332
Rights:
Copyright 2006 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Metrology
Physics and materials science
Physics: optics
Physics and materials science
Physics: optics
Accession Number:
edscal.17909105
Database:
PASCAL Archive
Weitere Informationen
As of today, several lead-free soldering pastes have been qualified for currently used soldering process. Regarding the new potential of laser-assisted soldering processes, the behaviour of the SnAgCu soldering paste requires, however, new investigations. In the first part of this study, the specific temperature profile of a laser soldering process is investigated using a high power diode laser (HPDL). These experimental results are compared to a thermal simulation developed for this specific application. The second part of this work deals with the diffusion of the tin-based filler material through the nickel barrier using the information extracted from the temperature simulations.