Result: Novel shear tools for viscoelastic characterization of packaging polymers

Title:
Novel shear tools for viscoelastic characterization of packaging polymers
Authors:
VAN'T HOF, C, JANSEN, K. M. B, WISSE, G, ERNST, L. J, YANG, D. G, ZHANG, G. Q, BRESSERS, H. J. L
Source:
Microelectronics and reliability. 47(2-3):240-247
Publisher Information:
Oxford: Elsevier, 2007.
Publication Year:
2007
Physical Description:
print, 5 ref
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Méthode analytique, Analytical method, Método analítico, Méthode numérique, Numerical method, Método numérico, Méthode élément fini, Finite element method, Método elemento finito, Packaging électronique, Electronic packaging, Packaging electrónico, Plaque parallèle, Parallel plate, Placa paralela, Polymère, Polymer, Polímero, Solution analytique, Analytical solution, Solución analítica
Document Type:
Conference Conference Paper
File Description:
text
Language:
English
Author Affiliations:
Delft University of Technology, Mekelweg 2, 2628 CD Delft, Netherlands
Philips CFT, P.O. Box 218, 5600 MD Eindhoven, Netherlands
Philips Semiconductors, P.O. Box 30008, 6534 AE Nijmegen, Netherlands
ISSN:
0026-2714
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=18518718
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.18518718
Database:
PASCAL Archive

Further Information

In order to calculate cure induced stresses, reliable material data is needed over a large modulus range. This paper concerns the derivation of correction equations needed for the interpretation of dynamic mechanical experiments on two different shear tools. For the first shear tool, consisting of an excitator plate sliding between two fixed parallel plates, the effect of the finite clamp stiffness on both the elastic and the viscoelastic modulus components are discussed. It turns out that this shear tool produces reliable results for modulus values in the range from 200 MPa and lower. The second shear tool consists of two parallel leaf springs between which the initially fluid sample is introduced. Clamping of the leaf spring ends and vertical displacement of the center then causes the sample to shear. Exact as well as approximate analytical solutions for the force-displacement relation are derived and are shown to compare well with finite element results. This second shear tool has a typical measuring range for modulus values of 20 MPa and higher.