Result: Virtual qualification of moisture induced failures of advanced packages

Title:
Virtual qualification of moisture induced failures of advanced packages
Authors:
VAN GILS, M. A. J, VAN DRIEL, W. D, ZHANG, G. Q, BRESSERS, H. J. L, VAN SILFHOUT, R. B. R, FAN, X. J, JANSSEN, J. H. J
Source:
Microelectronics and reliability. 47(2-3):273-279
Publisher Information:
Oxford: Elsevier, 2007.
Publication Year:
2007
Physical Description:
print, 17 ref
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Matériaux, Materials, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Action humidité, Humidity effect, Acción humedad, Assemblage brasage tendre, Soldered joint, Junta soldada, Assemblage circuit intégré, Integrated circuit bonding, Choix matériau, Material selection, Selección material, Dilatation thermique, Thermal expansion, Dilatación térmica, Diminution coût, Cost lowering, Reducción costes, Défaillance, Failures, Fallo, Délaminage, Delamination, Delaminación, Etude comparative, Comparative study, Estudio comparativo, Gauchissement, Warping, Torcimiento, Interface solide solide, Solid solid interface, Interfase sólido sólido, Matière à mouler, Molding compound, Materia para moldear, Packaging électronique, Electronic packaging, Packaging electrónico, Résistance humidité, Humidity resistance, Resistencia a la humedad, Technologie BGA, BGA technology, Tecnología BGA
Document Type:
Conference Conference Paper
File Description:
text
Language:
English
Author Affiliations:
Philips Applied Technologies, 5656 AE Eindhoven, Netherlands
IMO NXP Semiconductors, 6534 AE Nijmegen, Netherlands
Eindhoven University of Technology, 5600 MB, Eindhoven, Netherlands
Intel Corporation, Chandler, AZ 85248, United States
ISSN:
0026-2714
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=18518723
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.18518723
Database:
PASCAL Archive

Further Information

This paper presents a combined numerical and experimental methodology for predicting and preventing moisture induced failures in encapsulated packages. Prevention of such failures will enable efficient and optimal pre-selection of materials, their interfaces and geometric design with respect to the desired resistance to moisture. This virtual qualification methodology is illustrated for a specific BGA package which showed 50% failures (broken stitch-bonds) during HAST testing due to excessive warpage and/or delamination of different interfaces. For three different material combinations the moisture diffusion during the HAST test is predicted and subsequently thermo-mechanical-moisture simulations are performed where the effects of hygro-swelling, vapor pressure, thermal expansion and delamination on the failure mechanisms are predicted. The comparison of the simulation results of the different molding compounds with the observations of HAST testing indicates that the developed methods and models can predict the observed trends. Application of the presented methodology will result in shorter time-to-market and significant cost reduction due to reduced trial-and-error design cycles and effective material usage.