• Thermal simulation of UV laser...

Result: Thermal simulation of UV laser ablation of polyimide : Polytronic 2005

Title:
Thermal simulation of UV laser ablation of polyimide : Polytronic 2005
Authors:
GORDON, Péter, BALOGH, Balint, SINKOVICS, Balint
Source:
Microelectronics and reliability. 47(2-3):347-353
Publisher Information:
Oxford: Elsevier, 2007.
Publication Year:
2007
Physical Description:
print, 14 ref
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Fabrication microélectronique (technologie des matériaux et des surfaces), Microelectronic fabrication (materials and surfaces technology), Champ température, Temperature distribution, Campo temperatura, Dépendance température, Temperature dependence, Ecriture laser, Laser writing, Escritura láser, Fabrication microélectronique, Microelectronic fabrication, Fabricación microeléctrica, Impulsion laser, Laser pulse, Impulsión láser, Laser UV, Ultraviolet laser, Laser excimère, Excimer lasers, Logiciel, Software, Logicial, Microusinage, Micromachining, Micromaquinado, Méthode ablation laser, Laser ablation technique, Méthode analytique, Analytical method, Método analítico, Méthode numérique, Numerical method, Método numérico, Méthode élément fini, Finite element method, Método elemento finito, Polymère, Polymer, Polímero, Procédé fabrication, Manufacturing process, Procedimiento fabricación, Vitesse gravure, Etching rate, Velocidad grabado
Document Type:
Conference Conference Paper
File Description:
text
Language:
English
Author Affiliations:
Budapest University of Technology and Economics, Department of Electronics Technology, Goldmann tér 3, 1111 Budapest, Hungary
ISSN:
0026-2714
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=18518735
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.18518735
Database:
PASCAL Archive

Further Information

The aim of our research is to provide a simulation tool for manufacturing processes that takes the influence of temperature distribution thus the underlying copper pattern and pulse repetition frequency into account. To establish such simulation software, a finite element model was set up which is able to describe the thermal processes and ablation induced by laser irradiation of polymers. The etch rate description usually applied for excimer lasers was slightly altered to be adequate for Gaussian lasers by writing pulse energy instead of fluence. This theoretical consideration was proved by experiments. The experiments also revealed the temperature dependence of etch rate and the influence of pulse repetition frequency on the amount of ablated material. The experimental, analytical and simulation results are in good agreement.