• Mechanism and thermal effect o...

Result: Mechanism and thermal effect of delamination in light-emitting diode packages

Title:
Mechanism and thermal effect of delamination in light-emitting diode packages
Authors:
JIANZHENG HU, LIANQIAO YANG, MOO WHAN SHIN
Source:
Microelectronics journal. 38(2):157-163
Publisher Information:
Oxford: Elsevier Science, 2007.
Publication Year:
2007
Physical Description:
print, 13 ref
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Dispositifs optoélectroniques, Optoelectronic devices, Comportement thermique, Thermal behavior, Comportamiento térmico, Contrainte mécanique, Mechanical stress, Tensión mecánica, Diode électroluminescente, Light emitting diode, Diodo electroluminescente, Dispositif optoélectronique, Optoelectronic device, Dispositivo optoelectrónico, Distribution contrainte, Stress distribution, Campo restricción, Délaminage, Delamination, Delaminación, Effet température, Temperature effect, Efecto temperatura, Packaging électronique, Electronic packaging, Packaging electrónico, Préconditionnement, Preconditioning, Precondicionamiento, Résistance thermique, Thermal resistance, Resistencia térmica, 81.05.Ea; 81.70.Pg; 81.40.Gh, Delamination; Thermal resistance; Thermo-mechanical stress; Light-emitting diode
Document Type:
Conference Conference Paper
File Description:
text
Language:
English
Author Affiliations:
Department of Material Science and Engineering, Myongji University, 38-2 Nam-Dong, Yongin-Si. Kyunggi 449-728, Korea, Republic of
ISSN:
0959-8324
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=18522862
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.18522862
Database:
PASCAL Archive

Further Information

This work reports on the mechanism of delamination in light-emitting diode (LED) packages and its effects on thermal characteristics of LEDs. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical and hygro-mechanical stress distributions calculated from coupled-field FEA simulation agree well with the micrographical evidence. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 and 6 h under 85 °C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.