Treffer: Validation of the DJOSER analytical thermal simulator for electronic power devices and assembling structures
Title:
Validation of the DJOSER analytical thermal simulator for electronic power devices and assembling structures
Authors:
Source:
Microelectronics journal. 38(2):185-196
Publisher Information:
Oxford: Elsevier Science, 2007.
Publication Year:
2007
Physical Description:
print, 13 ref
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Appareillage électronique et fabrication. Composants passifs, circuits imprimés, connectique, Electronic equipment and fabrication. Passive components, printed wiring boards, connectics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Autres dispositifs multijonctions. Transistors de puissance. Thyristors, Other multijunction devices. Power transistors. Thyristors, Dispositifs à images, Imaging devices, Electrotechnique. Electroenergetique, Electrical engineering. Electrical power engineering, Electronique de puissance, alimentations électriques, Power electronics, power supplies, Champ température, Temperature distribution, Campo temperatura, Circuit puissance, Power circuit, Circuito potencia, Composant électronique, Electronic component, Componente electrónico, Diode puissance, Power diode, Diodo potencia, Dispositif puissance, Power device, Dispositivo potencia, Electronique puissance, Power electronics, Electrónica potencia, Enregistrement, Recording, Registro, Imagerie thermique, Thermal imaging, Imageria termica, Modèle mathématique, Mathematical model, Modelo matemático, Multicouche, Multiple layer, Capa múltiple, Méthode numérique, Numerical method, Método numérico, Méthode élément fini, Finite element method, Método elemento finito, Programme simulation, Simulation program, Programa simulación, Régime permanent, Steady state, Régimen permanente, Simulateur, Simulator, Simulador, Structure électronique, Electronic structure, Estructura electrónica, Analytical, Electronics, Power, Simulation, Temperature
Document Type:
Konferenz
Conference Paper
File Description:
text
Language:
English
Author Affiliations:
Department of Information Engineering, University of Pisa, Via Caruso 16, 56100 Pisa, Italy
Department of Energetics 'L.Poggi', University of Pisa, Via Diotisalvi 2, 56100 Pisa, Italy
Department of Energetics 'L.Poggi', University of Pisa, Via Diotisalvi 2, 56100 Pisa, Italy
ISSN:
0959-8324
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electrical engineering. Electroenergetics
Electronics
Electronics
Accession Number:
edscal.18522866
Database:
PASCAL Archive
Weitere Informationen
The present communication deals with the tests for the validation of the DJOSER steady-state thermal simulation program, purposely designed for power electronic assembling structures and which is based on the resolution of analytical relationships. The validation experiments were carried out theoretically by comparing the thermal maps with those obtained using standard finite-elements programs and yielding temperature accuracy below 1%. Experimental tests were also performed on purposely built multi-layer structures and industrial circuits with power diodes mounted in naked-chip configuration. The simulated maps were compared with accurate thermographic recordings and showed a good agreement, testifying the validity of the mathematical model.