Treffer: InP-based IC technologies

Title:
InP-based IC technologies
Source:
Proceedings of the Third International Conference on Materials for Advanced Technologies (ICMAT 2005) Symposium J: III-V Semiconductors for Microelectronic and Optoelectronic Applications, Singapore, July 3-8, 2005Thin solid films. 515(10):4313-4320
Publisher Information:
Lausanne: Elsevier Science, 2007.
Publication Year:
2007
Physical Description:
print, 34 ref
Original Material:
INIST-CNRS
Time:
8540
Document Type:
Konferenz Conference Paper
File Description:
text
Language:
English
Author Affiliations:
NTT Photonics Laboratories, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa, 243-0198, Japan
ISSN:
0040-6090
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.18618616
Database:
PASCAL Archive

Weitere Informationen

The research and development of InP-based devices and integrated circuits (ICs) are driven by applications in broadband optical-fiber communications systems and microwave and millimeter-wave wireless systems. This paper describes recent progress on our InP-based device and IC technologies for 40-Gbit/s optical fiber communications and 10-Gbit/s class millimeter-wave wireless links. Device performance requirements for future 100-Gbit/s class ICs are then discussed along with our device technology roadmap. We also describe our latest 100-Gbit/s class optical fiber communication IC results.