Result: Thermal analysis of LED array system with heat pipe

Title:
Thermal analysis of LED array system with heat pipe
Authors:
KIM, Lan, JONG HWA CHOI, SUN HO JANG, MOO WHAN SHIN
Source:
6th symposium of the Korean Society of thermophysical propertiesThermochimica acta. 455(1-2):21-25
Publisher Information:
Amsterdam: Elsevier Science, 2007.
Publication Year:
2007
Physical Description:
print, 11 ref
Original Material:
INIST-CNRS
Subject Terms:
General chemistry, physical chemistry, Chimie générale, chimie physique, Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Dispositifs optoélectroniques, Optoelectronic devices, Analyse thermique, Thermal analysis, Análisis térmico, Caloduc, Heat pipe, Tubo de calor, Diode électroluminescente, Light emitting diode, Diodo electroluminescente, Impédance électrique, Electrical impedance, Impedancia eléctrica, Réseau diode, Diode array, Red diodo, Résistance thermique, Thermal resistance, Resistencia térmica, Schéma équivalent, Equivalent circuit, Esquema equivalente, Spectrométrie UV visible, Ultraviolet visible spectrometry, Espectrometría UV visible, Junction temperature, LED array
Document Type:
Conference Conference Paper
File Description:
text
Language:
English
Author Affiliations:
Department of Materials Science & Engineering, Myong Ji University, 38-2 Nam-Dong, Yongin, Kyunggi 449-728, Korea, Republic of
ISSN:
0040-6031
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=18642230
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.18642230
Database:
PASCAL Archive

Further Information

This paper reports on thermal characterization of high power LED arrays. Thermal transient methods are used to measure the junction temperature and calculate the thermal resistance. The emphasis is placed upon the investigation of junction temperature rise of LED array for a limited range of boundary conditions which include design effect of heat pipe, convection condition, and ambient temperature. The junction temperatures of LED array with and without heat pipe at the same air velocity of 7 m/s were 87.6 °C, and 63.3 °C, respectively. The corresponding thermal resistances of LED array were measured to be 1.8 K/W and 2.71 K/W. It was found out that the measured junction temperatures and thermal resistance of LED array are increased with the input power and ambient temperature, but decreased with the air velocity. An analytical thermal model analogous with an equivalent parallel circuit system was proposed and was verified by comparison with experimental data.