Result: Wrapper design for the reuse of a bus, network-on-chip, or other functional interconnect as test access mechanism

Title:
Wrapper design for the reuse of a bus, network-on-chip, or other functional interconnect as test access mechanism
Source:
Selected best papers from ETS'06IET computers & digital techniques (Print). 1(3):197-206
Publisher Information:
Stevenage: Institution of Engineering and Technology, 2007.
Publication Year:
2007
Physical Description:
print, 39 ref
Original Material:
INIST-CNRS
Subject Terms:
Document Type:
Conference Conference Paper
File Description:
text
Language:
English
Author Affiliations:
Federal University of Rio Grande do Sul - UFRGS, Instituto de Informática, Av. Bento Gonçalves 9500, Porto Alegre, RS, Brazil
NXP Semiconductors Research, High Tech Campus 37, 5656 AE Eindhoven, Netherlands
University of Delft, Department of Computer Engineering, Mekelweg 5, 2628 CC Delft, Netherlands
Catholic University - PUCRS, Faculdade de Informática, Av. Ipiranga 6681, Porto Alegre, RS, Brazil
ISSN:
1751-8601
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.18789652
Database:
PASCAL Archive

Further Information

A new core test wrapper design approach is proposed which transports streaming test data, for example scan test patterns, into and out of an embedded core exclusively via (some of) its functional data ports. The latter are typically based on standardised protocols such as AXI, DTL, and OCP. The new wrapper design allows a functional interconnect, such as an on-chip bus or network-on-chip (NOC) to transport test data to embedded cores, and hence eliminates the need for a conventional dedicated test access mechanism (TAM), such as a TestRail or test bus. The approach leaves both the tester, as well as the embedded core and its test unchanged, while the functional interconnect can handle the test data transport as a regular data application. The functional interconnect is required to offer guaranteed throughput and zero latency variation, a service that is available in many buses and networks. For 672 example cases based on the ITC'02 System-on-Chip (SOC) Test Benchmarks, the new approach in comparison with the conventional approach shows an average wrapper area increase of 14.5%, which is negligible at the SOC level, especially since the dedicated TAM can be eliminated. Futhermore, the new approach decreases the core test length by 3.8% on average.