Treffer: Optimization of demolding temperature for throughput improvement of nanoimprint lithography
Title:
Optimization of demolding temperature for throughput improvement of nanoimprint lithography
Authors:
Source:
Proceedings of the 32nd International Conference on Micro- and Nano-Engineering, Barcelona, 17-20 September 2006Microelectronic engineering. 84(5-8):953-957
Publisher Information:
Amsterdam: Elsevier Science, 2007.
Publication Year:
2007
Physical Description:
print, 7 ref
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Fabrication microélectronique (technologie des matériaux et des surfaces), Microelectronic fabrication (materials and surfaces technology), Antenne imprimée, Printed antenna, Antena imprimida, Assemblage circuit intégré, Integrated circuit bonding, Brasage avec refusion, Reflow soldering, Soldeo con refusión, Effet température, Temperature effect, Efecto temperatura, Energie libre, Free energy, Energía libre, Energie surface, Surface energy, Energía superficie, Fabrication microélectronique, Microelectronic fabrication, Fabricación microeléctrica, Gaufrage, Embossing, Gofrado, Gestion température packaging électronique, Thermal management (packaging), Lithographie, Lithography, Litografía, Microscopie force atomique, Atomic force microscopy, Microscopía fuerza atómica, Nanolithographie, Nanolithography, Optimisation, Optimization, Optimización, Polymère, Polymer, Polímero, Recuit, Annealing, Recocido, Résist, Resist, Resistencia, Système refroidissement, Cooling system, Sistema enfriamiento, Temps exécution, Execution time, Tiempo ejecución, Température recuit, Annealing temperature, Temperatura recocido, Thermoplastique, Thermoplastics, Termoplástica, Demolding modelisation, Nanoimprint lithography, Patterns reflow, Throughput optimization
Document Type:
Konferenz
Conference Paper
File Description:
text
Language:
English
Author Affiliations:
CEA Leti-Minatec 17 rue des martyrs, 38054 Grenoble, France
LEGI/ENSHMG, 1025 rue de la piscine Dom. Univ. BP 53, 38041 Grenoble, France
CNRS-LTM, 17 rue des martyrs, 38054 Grenoble, France
LEGI/ENSHMG, 1025 rue de la piscine Dom. Univ. BP 53, 38041 Grenoble, France
CNRS-LTM, 17 rue des martyrs, 38054 Grenoble, France
ISSN:
0167-9317
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.18807351
Database:
PASCAL Archive
Weitere Informationen
Annealing effects onto the reflow of imprinted resist patterns have been investigated on 250 nm dense line arrays printed with standard not embossing lithography and thermoplastic polymer. Atomic force microscopy measurements were performed to point out the annealing temperature and time effects, respectively. The reflow velocity with respect to annealing temperature has been determined. Its variation is ascribed to both resist dynamic viscosity and surface free energy. Our approach demonstrated that imprint cycle time could be significantly reduced by saving cooling down time.