Result: Substrate independent fabrication of a non-planar probe card
Title:
Substrate independent fabrication of a non-planar probe card
Authors:
Source:
Proceedings of the 32nd International Conference on Micro- and Nano-Engineering, Barcelona, 17-20 September 2006Microelectronic engineering. 84(5-8):1207-1210
Publisher Information:
Amsterdam: Elsevier Science, 2007.
Publication Year:
2007
Physical Description:
print, 12 ref
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Dispositifs micro- et nanoélectromécaniques (mems/nems), Micro- and nanoelectromechanical devices (mems/nems), Connexion électrique, Electrical connection, Conexión eléctrica, Dispositif microélectromécanique, Microelectromechanical device, Dispositivo microelectromecánico, Endommagement, Damaging, Deterioración, Essai circuit intégré, Integrated circuit testing, Pastille électronique, Wafer, Pastilla electrónica, Poutre cantilever, Cantilever beam, Viga cantilever, Procédé fabrication, Manufacturing process, Procedimiento fabricación, Technologie planaire, Planar technology, Tecnología planar, 3D, AZ9260, MEMS, Non-planar, Probe card
Document Type:
Conference
Conference Paper
File Description:
text
Language:
English
Author Affiliations:
School of Engineering, University of Durham, County Durham DH1 3LE, United Kingdom
ISSN:
0167-9317
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.18807410
Database:
PASCAL Archive
Further Information
During conventional wafer level testing of integrated circuits, temporary electrical connections are formed by tungsten needles. There is a desire to replace this technology since it is becoming increasingly difficult to assemble probes with the required geometric tolerances. Furthermore, the forces exerted can damage the device under test. We describe a novel process for the fabrication of non-planar nickel cantilevers. The process is low temperature and independent of the substrate material, which allows the cantilevers to be fabricated on to previously processed wafers. Finally, examples of fabricated devices are discussed.