Result: Optimal process parameters design for a wire bonding of ultra-thin CSP package based on hybrid methods of artificial intelligence

Title:
Optimal process parameters design for a wire bonding of ultra-thin CSP package based on hybrid methods of artificial intelligence
Authors:
HUNG, Yung-Hsiang
Source:
Microelectronics international. 24(3):3-10
Publisher Information:
Bradford: MCB University Press, 2007.
Publication Year:
2007
Physical Description:
print, 3/4 p
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Circuits électriques, optiques et optoélectroniques, Electric, optical and optoelectronic circuits, Réseaux neuronaux, Neural networks, Algorithme génétique, Genetic algorithm, Algoritmo genético, Algorithme évolutionniste, Evolutionary algorithm, Algoritmo evoluciónista, Assemblage circuit intégré, Integrated circuit bonding, Circuit intégré, Integrated circuit, Circuito integrado, Conception optimale, Optimal design, Concepción optimal, Couche ultramince, Ultrathin films, Excitateur, Driver, Excitador, Intelligence artificielle, Artificial intelligence, Inteligencia artificial, Interconnexion, Interconnection, Interconexión, Montage surface composant, Surface mount technology, Montaje superficie componente, Méthode Taguchi, Taguchi method, Método Taguchi, Optimisation, Optimization, Optimización, Packaging électronique, Electronic packaging, Packaging electrónico, Plan expérience, Experimental design, Plan experiencia, Procédé fabrication, Manufacturing process, Procedimiento fabricación, Robustesse, Robustness, Robustez, Réseau neuronal, Neural network, Red neuronal, Technologie CSP, Chip scale packaging, Théorie algorithme, Algorithm theory, Microcâblage, Wire bonding, Unión por hilo, Système en réseau, Networked system, Programming and algorithm theory
Document Type:
Academic journal Article
File Description:
text
Language:
English
Author Affiliations:
Department of Industrial Engineering and Management, National Chin-Yi University of Technology, Taiping, Tawain, Province of China
ISSN:
1356-5362
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=19005005
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.19005005
Database:
PASCAL Archive

Further Information

Purpose - The aim of this research is to combine the Taguchi method and hybrid methods of artificial intelligence, to use them as the optimal tool in wire bond designing parameters for an ultra-thin chip scale package (CSP) package, and then construct a set of the optimal parameter analysis flow and steps. Design/methodology/approach - The hybrid methodology of artificial Intelligence was used in order to identify the optimum parameters design for a wire bonding of ultra-thin CSP package. This paper employed desirability function to integrate two quality characteristics (loop height and wire pull strength) into a single quality indicator to construct a well-trained neural network prediction system with hybrid genetic algorithm. Findings - The processes parameters of low-loop of micro HDD driver IC were optimized with GA, thereby achieving the objective of improving process yield and robustness design of micro HDD driver IC. Practical implications - The engineers could quickly obtain the optimal production process parameter with the demand of multi-quality characteristics, and enhance the assembly quality and yield of driver IC of micro HDD. Originality/value - This paper applies the design of experiments approach to a lower wire loop processes parameters design, and improves the process yield and robustness design of micro HDD driver IC.