Result: Development of SFQ multi-chip modules for quantum bits

Title:
Development of SFQ multi-chip modules for quantum bits
Authors:
MIYAZAKI, Toshiyuki, YOROZU, Shinichi, MAEZAWA, Masaaki, HIDAKA, Mutsuo, TSAI, Jaw-Shen
Source:
The 2006 applied superconductivity conference, Seattle, WA, August 27-September 1, 2006IEEE transactions on applied superconductivity. 17(2):158-161
Publisher Information:
New York, NY: Institute of Electrical and Electronics Engineers, 2007.
Publication Year:
2007
Physical Description:
print, 10 ref 1
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Electrical engineering, Electrotechnique, Sciences exactes et technologie, Exact sciences and technology, Physique, Physics, Generalites, General, Physiques classique et quantique: mécanique et champs, Classical and quantum physics: mechanics and fields, Information quantique, Quantum information, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Dispositifs supraconducteurs, Superconducting devices, Circuits électriques, optiques et optoélectroniques, Electric, optical and optoelectronic circuits, Propriétés des circuits, Circuit properties, Circuits électroniques, Electronic circuits, Circuits numériques, Digital circuits, Assemblage brasage tendre, Soldered joint, Junta soldada, Assemblage circuit intégré, Integrated circuit bonding, Circuit interface, Interface circuit, Circuito intercara, Circuit intégré supraconducteur, Superconducting integrated circuits, Circuit logique supraconducteur, Superconducting logic circuits, Conception circuit intégré, Integrated circuit design, Conductance thermique, Thermal conductance, Conductancia térmica, Connexion par billes, Flip chip bonding, Conexión espesada, Cycle thermique, Thermal cycle, Ciclo térmico, Durabilité, Durability, Durabilidad, Electronique quantique, Quantum electronics, Fiabilité, Reliability, Fiabilidad, Information quantique, Quantum information, Información cuántica, Logique quantique, Quantum logic, Lógica cuántica, Mesure température, Temperature measurement, Medida temperatura, Module multipuce, Multichip module, Modulo multipulga, Puce électronique, Chip, Pulga electrónica, Réduction bruit, Noise reduction, Reducción ruido, Suppression interférence, Interference suppression, Température ambiante, Room temperature, Temperatura ambiente, Thermomètre, Thermometer, Termómetro, Thermométrie, Thermometry, Termometría, -DC SQUID, SFQ, quantum bits, thermal conductance
Time:
0367
Document Type:
Conference Conference Paper
File Description:
text
Language:
English
Author Affiliations:
Japan Science and Technology Agency, SRL, NEC Tsukuba Lab, 34 Miyukigaoka, Tsukuba, Ibaraki 305-8501, Japan
NEC Corp., 34 Miyukigaoka, Tsukuba, Ibaraki 305-8501, Japan
Advanced Industrial Science and Technology, Tsukuba, Ibaraki 305-8561, Japan
International Superconductivity Technology Center, Tsukuba, Ibaraki 305-8501, Japan
ISSN:
1051-8223
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=19010164
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics

Theoretical physics
Accession Number:
edscal.19010164
Database:
PASCAL Archive

Further Information

-We developed a multi-chip module (MCM) system of superconducting quantum bits with single-flux quantum (SFQ) interface circuits. The MCM system consists of chips with quantum bits and chips with SFQ circuits mounted on a base chip by flip-chip bonding (FCB) with superconducting solder. We report on a reliability test of the MCM system. The test was done using a resistance measurement of an MCM with 30 μm diameter bumps. Tested samples showed good durability against thermal cycles between room temperature and 4.2 K. At 4.2 K, the resistance measured through more than two hundred bumps in a series was less than 1 mΩ. Along with achieving a high reliability, reducing thermal interference from SFQ circuits to quantum bits is important. We must understand the thermal conductance between and within the chips to design a system with minimum interference. An MCM on-chip thermometer which is based on the Johnson noise thermometry, has been designed and fabricated to achieve this desired level. The preliminary results of the thermal measurement are reported.