Result: Single flux quantum circuit and packaging technology for sub-kelvin temperature operation

Title:
Single flux quantum circuit and packaging technology for sub-kelvin temperature operation
Authors:
YOROZU, Shinichi, MIYAZAKI, Toshiyuki, SEMENOV, Vasili, HIDAKA, Mutsuo, TSAI, Jaw-Shen
Source:
The 2006 applied superconductivity conference, Seattle, WA, August 27-September 1, 2006IEEE transactions on applied superconductivity. 17(2):967-970
Publisher Information:
New York, NY: Institute of Electrical and Electronics Engineers, 2007.
Publication Year:
2007
Physical Description:
print, 16 ref 1
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Electrical engineering, Electrotechnique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Dispositifs supraconducteurs, Superconducting devices, Circuits électriques, optiques et optoélectroniques, Electric, optical and optoelectronic circuits, Propriétés des circuits, Circuit properties, Circuits électroniques, Electronic circuits, Circuits numériques, Digital circuits, Electrotechnique. Electroenergetique, Electrical engineering. Electrical power engineering, Matériel électrique divers, Various equipment and components, Eléments de connexion. Câblage. Filerie, Electric connection. Cables. Wiring, Assemblage brasage tendre, Soldered joint, Junta soldada, Assemblage circuit intégré, Integrated circuit bonding, Autoéchauffement, Self heating, Autocalentamiento, Barrière potentiel, Potential barrier, Barrera potencial, Circuit intégré supraconducteur, Superconducting integrated circuits, Circuit logique supraconducteur, Superconducting logic circuits, Circuit puissance, Power circuit, Circuito potencia, Comportement thermique, Thermal behavior, Comportamiento térmico, Connexion électrique, Electrical connection, Conexión eléctrica, Contact bosse, Solder bump, Contacto con bollos, Courant critique, Critical current, Corriente crítica, Economie réseau électrique, Power system economics, Electronique puissance, Power electronics, Electrónica potencia, Electronique quantique, Quantum electronics, Fiabilité, Reliability, Fiabilidad, Information quantique, Quantum information, Información cuántica, Jonction Josephson, Josephson junction, Unión Josephson, Logique quantique, Quantum logic, Lógica cuántica, Marché électricité, Power markets, Miniaturisation, Miniaturization, Miniaturización, Module multipuce, Multichip module, Modulo multipulga, Packaging électronique, Electronic packaging, Packaging electrónico, Puce électronique, Chip, Pulga electrónica, Sensibilité, Sensitivity, Sensibilidad, Système multiple, Multiple system, Sistema múltiple, Transmission donnée, Data transmission, Transmisión datos, -Multi-chip module, RSFQ, qubit, single flux quantum
Time:
0367
Document Type:
Conference Conference Paper
File Description:
text
Language:
English
Author Affiliations:
Fundamental and Environmental Research Laboratories, NEC Corporation, 34 Miyukigaoka, Tsukuba, Ibaraki 305-8501, Japan
Japan Science and Technology Agency, NEC Tsukuba Lab, 34 Miyukigaoka, Tsukuba, Ibaraki 305-8501, Japan
Department of Physics and Astronomy, Stony Brook University, Stony Brook, NY 11974-3800, United States
International Superconductivity Technology Center, Tsukuba, Ibaraki, 305-8501, Japan
ISSN:
1051-8223
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=19010357
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electrical engineering. Electroenergetics

Electronics
Accession Number:
edscal.19010357
Database:
PASCAL Archive

Further Information

-Superconducting single flux quantum (SFQ) technology is well known for digital logic operations below 4.2 K, which are compatible with the Josephson junction qubit. Operation speed and signal sensitivity of circuits in SFQ are also sufficient to control qubits. Therefore, the SFQ circuit is a candidate technology for multiple qubit control. However, the self-heating effect of the SFQ circuit is a potential barrier to development of an SFQ-supported multiple qubit system because the qubit operating temperature is lower than the conventional 4.2 K. The multi-chip approach is a possible solution because the qubit chip can be thermally isolated from the SFQ circuitry. We report on recent progress in SFQ circuit and packaging technology for operation at sub-Kelvin temperatures. As for multi-chip module technology, a test sample of the multi-chip module shows good reliability of electrical connections between chips, and each solder bump has a bandwidth wide enough for signal transmission. We have designed lower power SFQ circuits for sub-Kelvin temperatures. The critical currents of Josephson junctions were scaled down, inductances were scaled up, and bias voltage was reduced to make power consumption lower. Based on our fabrication technology, critical current densities were optimized by considering trade-off relations between fabrication availability and operation speed. We successfully confirmed its correct operations at around 0.35 K. The combination of the multi-chip module and optimized SFQ circuits is very effective way of controlling qubit.