Result: Uniformity characteristics of Bi2212 tubes depending on cooling conditions

Title:
Uniformity characteristics of Bi2212 tubes depending on cooling conditions
Authors:
LEE, N. I, JANG, G. E, HA, D. W
Source:
The 2006 applied superconductivity conference, Seattle, WA, August 27-September 1, 2006. Part III of three partsIEEE transactions on applied superconductivity. 17(2):3008-3011
Publisher Information:
New York, NY: Institute of Electrical and Electronics Engineers, 2007.
Publication Year:
2007
Physical Description:
print, 9 ref 3
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Electrical engineering, Electrotechnique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Dispositifs supraconducteurs, Superconducting devices, Electrotechnique. Electroenergetique, Electrical engineering. Electrical power engineering, Appareillage de connexion et de protection, Connection and protection apparatus, Champ température, Temperature distribution, Campo temperatura, Dispositif protection, Protective device, Dispositivo protección, Dispositif supraconducteur, Superconductor device, Dispositivo supraconductor, Epaisseur, Thickness, Espesor, Fluctuation température, Temperature fluctuation, Fluctuación temperatura, Formage, Forming, Conformado, Gestion température packaging électronique, Thermal management (packaging), Limiteur courant défaut, Fault current limiters, Loi uniforme, Uniform distribution, Ley uniforme, Prévention dommage, Damage prevention, Prevención daño, Refroidissement, Cooling, Enfriamiento, Simulation système, System simulation, Simulación sistema, Supraconducteur haute température, High temperature superconductor, Supraconductor alta temperatura, Système refroidissement, Cooling system, Sistema enfriamiento, Texture, Textura, Vitesse refroidissement, Cooling rate, Velocidad enfriamiento, Centrifugal forming process, SCFCL, mold design, uniformity
Document Type:
Conference Conference Paper
File Description:
text
Language:
English
Author Affiliations:
Department of Materials Engineering, Chungbuk National University, Chungbuk 361-763, Korea, Republic of
Korea Electrotechnology Research Institute, Kyongnam 641-120, Korea, Republic of
ISSN:
1051-8223
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=19016934
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electrical engineering. Electroenergetics

Electronics
Accession Number:
edscal.19016934
Database:
PASCAL Archive

Further Information

For the possible application of resistive Superconducting Fault Current Limiters (SCFCL), Bi-2212 tube was fabricated by Centrifugally Forming Process (CFP) in terms of different mold designs and cooling rates. Typical tube size was 30 mm in diameter with 3 mm thickness and 100 mm in length. In order to check tube uniformity characteristics, heat and fluid analysis technique of EFDLab was adopted. When the tube was cooled down from 900 °C for 100 sec, we found that there was quite different temperature variation along the tube. Based on the results of simulation and experimental data, it was confirmed that the mold designed for the effective heat circulation has more uniform temperature distribution and fast cooling rate in tube, which associated with better texture formation and thereby shows greater electric properties.