• Study of the surface morpholog...

Result: Study of the surface morphology of Nb films and the microstructure of Nb/AlOx-Al/Nb trilayers

Title:
Study of the surface morphology of Nb films and the microstructure of Nb/AlOx-Al/Nb trilayers
Authors:
JIA DU, CHARLES, Andrew D. M, PETERSSON, Karl D
Source:
The 2006 applied superconductivity conference, Seattle, WA, August 27-September 1, 2006. Part III of three partsIEEE transactions on applied superconductivity. 17(2):3520-3524
Publisher Information:
New York, NY: Institute of Electrical and Electronics Engineers, 2007.
Publication Year:
2007
Physical Description:
print, 12 ref 3
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Electrical engineering, Electrotechnique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Dispositifs supraconducteurs, Superconducting devices, Anodisation, Anodizing, Anodización, Caractéristique courant tension, Voltage current curve, Característica corriente tensión, Couche mince, Thin film, Capa fina, Courant fuite, Leakage current, Corriente escape, Epaisseur, Thickness, Espesor, Formation dépôt, Deposit formation, Formación depósito, Gestion température packaging électronique, Thermal management (packaging), Jonction Josephson, Josephson junction, Unión Josephson, Jonction tunnel, Tunnel junction, Unión túnel, Microscopie force atomique, Atomic force microscopy, Microscopía fuerza atómica, Microscopie électronique transmission, Transmission electron microscopy, Microscopía electrónica transmisión, Microstructure, Microestructura, Pulvérisation cathodique, Cathodic sputtering, Pulverización catódica, Pulvérisation irradiation, Sputtering, Pulverización irradiación, Refroidissement, Cooling, Enfriamiento, Rugosité, Roughness, Rugosidad, Structure surface, Surface structure, Estructura superficie, Système refroidissement, Cooling system, Sistema enfriamiento, Cross-sectional microstructure, Nb/AlOx-Al/Nb trilayer, niobium (Nb) film, surface morphology
Document Type:
Conference Conference Paper
File Description:
text
Language:
English
Author Affiliations:
CSIRO Industrial Physics, Lindfield, NSW 2070, Australia
University of Sydney, NSW 2006, Australia
Cavendish Laboratory, University of Cambridge, United Kingdom
ISSN:
1051-8223
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=19017064
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.19017064
Database:
PASCAL Archive

Further Information

To optimize the current-voltage characteristics of Nb/AlOx-Al/Nb Josephson tunnel junctions, a uniform and well defined insulating barrier (AlOx) is required so that no leakage current occurs between the upper and lower Nb electrodes. We investigated the dependence of the surface morphology of de magnetron-sputtered Nb thin films on deposition parameters using atomic force microscopy (AFM), the cross-sectional microstructure of the Nb/AlOx-Al/Nb trilayers using transmission electron microscopy (TEM), and anodization profiling. The surface roughness of the base Nb layer was found to affect the AlOx-Al layer and thus the quality of Nb/AlOx-Al/Nb trilayer. Diffusion of Al at the Al/Nb interface increases with increasing roughness of the base Nb layer, which increases the minimum Al thickness required to cover base-Nb. The importance of sufficient sample-cooling during the trilayer deposition was also confirmed by the TEM study and anodization profiling.