Treffer: Defect detection of IC wafer based on two-dimension wavelet transform

Title:
Defect detection of IC wafer based on two-dimension wavelet transform
Source:
Microelectronics journal. 41(2-3):171-177
Publisher Information:
Kidlington: Elsevier, 2010.
Publication Year:
2010
Physical Description:
print, 20 ref
Original Material:
INIST-CNRS
Document Type:
Fachzeitschrift Article
File Description:
text
Language:
English
Author Affiliations:
Key Lab of Ministry of Education for Wide Band-Gap Semiconductor Devices, School of Microelectronics, Xidian University, Xi'an, Shaanxi 710071, China
ISSN:
0959-8324
Rights:
Copyright 2015 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.22615992
Database:
PASCAL Archive

Weitere Informationen

Defect detection of integrated circuit (IC) wafer based on two-dimension wavelet transform (2-D DWT) is presented in this paper. By utilizing the characteristics many of the same chips in a wafer, three images with defects located in the same position and different chips are obtained. The defect images contain the standard image without any defects. 2-D DWT presented in the paper can extract the standard image from the three defect images. The algorithm complexity of the method is close to that of 2-D DWT. After obtaining the standard image, the speed and accuracy of defects detection can be greatly enhanced using the detection method presented in the paper. Using the image gray-scale matching technology, impact of illumination on IC defect detection is solved. Experiments demonstrate that 2-D DWT is fast and accurate to defects detection in an IC image, and the method has high robustness for illumination.