KNICKERBOCKER, J. U., PATEL, C. S., COTTE, J. M., ANDRY, P. S., TSANG, C. K., PAIVIKKI BUCHWALTER, L., SPROGIS, E. J., HUA GAN, HORTON, R. R., POLASTRE, R. J., & WRIGHT, S. L. (2006, Januar 1). 3-D silicon integration and silicon packaging technology using silicon through-vias. 41(8). New York, NY: Institute of Electrical and Electronics Engineers, 2006. Abgerufen von http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18032567

KNICKERBOCKER, John U, PATEL, Chirag S, COTTE, John M, ANDRY, Paul S, TSANG, Cornelia K, PAIVIKKI BUCHWALTER, L, SPROGIS, Edmund J, HUA GAN, HORTON, Raymond R, POLASTRE, Robert J und WRIGHT, Steven L, 2006. 3-D silicon integration and silicon packaging technology using silicon through-vias. In: [online]. New York, NY: Institute of Electrical and Electronics Engineers, 2006. 1 Januar 2006. Available from: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18032567

KNICKERBOCKER, J. U., C. S. PATEL, J. M. COTTE, P. S. ANDRY, C. K. TSANG, L. PAIVIKKI BUCHWALTER, E. J. SPROGIS, HUA GAN, R. R. HORTON, R. J. POLASTRE, und S. L. WRIGHT. 3-D silicon integration and silicon packaging technology using silicon through-vias. Nr. 8, New York, NY: Institute of Electrical and Electronics Engineers, 2006., 2006, http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18032567.

KNICKERBOCKER, J.U., PATEL, C.S., COTTE, J.M., ANDRY, P.S., TSANG, C.K., PAIVIKKI BUCHWALTER, L., SPROGIS, E.J., HUA GAN, HORTON, R.R., POLASTRE, R.J. und WRIGHT, S.L. (2006), „3-D silicon integration and silicon packaging technology using silicon through-vias“, in , Bd. 41, New York, NY: Institute of Electrical and Electronics Engineers, 2006., verfügbar unter: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18032567.