Treffer: Simulation and Reliability Assessment of Advanced Packaging
Title:
Simulation and Reliability Assessment of Advanced Packaging
Contributors:
Chiang, Kuo-Ning
Publisher Information:
MDPI - Multidisciplinary Digital Publishing Institute, 2024.
Publication Year:
2024
Subject Terms:
flip-chip package, 2.5D package, thermal warpage, strain gauge, electronic packaging, dynamic storage modulus, loss tangent, optimization, bivariate cut-HDMR, semiconductor packaging, central composite design, R-squared, relative average absolute error, flip chip package on package, finite element analysis, viscoelastic behavior, process-induced warpage, trace mapping, effective modeling, solder joint fatigue risk estimation, wafer level chip-scaled packaging, artificial neural network, recurrent neural network, generic algorithm, principle component analysis, time/temperature-dependent nonlinearity, MOSFET, TSV, annealing process, carrier mobility estimation, FEM simulation, WLP, AI, machine learning, ANN, RNN, SVR, KRR, KNN, RF, regression model, electro-thermal coupling analysis, power MOSFET inverter, power loss, circuit simulation, computational fluid dynamics, Foster thermal network, Micro-Electro-Mechanical Systems, moisture sensitivity level test, reflow process, finite element method, cohesive zone model, bonding strength, precondition test, low-temperature co-fired ceramics (LTCCs), dielectric constant, dissipation factor, numerical simulation, thermal design, thermal stress, PVT growth, AlN single crystals, flip-chip process, strip warpage, bump, Ag–In alloy pastes, mechanical alloying, power semiconductor packaging, die attachment, mechanical properties, oxidation mechanism, multiple reflows, synchrotron, composite solder, Wafer-Level Package (WLP), Finite Element Analysis (FEA), Kernel Ridge Regression (KRR), Cluster algorithm, micro-joints, solid-state reaction, intermetallic, adhesion layer, Equation-Informed Neural Networks, advanced electronic packaging, numerical Bayesian Inference, constitutive equations, Pb-free SAC305 solders, Technology: general issues
Document Type:
E-Book
eBook
File Description:
application/octet-stream
Language:
English
ISBN:
978-3-7258-0972-1
978-3-7258-0971-4
978-3-7258-0971-4
DOI:
10.3390/books978-3-7258-0971-4
Access URL:
Rights:
Attribution-NonCommercial-NoDerivatives 4.0 International
open access
URL: http://purl.org/coar/access_right/c_abf2
URL: https://creativecommons.org/licenses/by-nc-nd/4.0/
open access
URL: http://purl.org/coar/access_right/c_abf2
URL: https://creativecommons.org/licenses/by-nc-nd/4.0/
Notes:
ONIX_20240514_9783725809721_550
Accession Number:
edsdob.20.500.12854.137935
Database:
Directory of Open Access Books
Weitere Informationen
Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint.