Khan, Z., Gururajan, D., Koltay, P., Kartmann, S., Zengerle, R., & Shu, Z. [ca. 2024]. Hybrid 3 D printing of molten metal microdroplets and polymers for prototyping of printed circuit boards featuring interdigitated 3 D capacitors [Cd]. Freiburg: Universität. https://doi.org/10.1002/tee.24035

KHAN, Zeba, GURURAJAN, Dheepesh, KOLTAY, Peter, KARTMANN, Sabrina, ZENGERLE, Roland und SHU, Zhe, 2024. Hybrid 3 D printing of molten metal microdroplets and polymers for prototyping of printed circuit boards featuring interdigitated 3 D capacitors. Freiburg: Universität.

Khan, Z., D. Gururajan, P. Koltay, S. Kartmann, R. Zengerle, und Z. Shu. Hybrid 3 D printing of molten metal microdroplets and polymers for prototyping of printed circuit boards featuring interdigitated 3 D capacitors. cd, Universität, 2024, https://doi.org/10.1002/tee.24035.

Khan, Zeba/Gururajan, Dheepesh/Koltay, Peter/Kartmann, Sabrina/Zengerle, Roland/Shu, Zhe: Hybrid 3 D printing of molten metal microdroplets and polymers for prototyping of printed circuit boards featuring interdigitated 3 D capacitors, Freiburg 2024.

Khan, Z., Gururajan, D., Koltay, P., Kartmann, S., Zengerle, R. und Shu, Z. (2024), Hybrid 3 D printing of molten metal microdroplets and polymers for prototyping of printed circuit boards featuring interdigitated 3 D capacitors, Bd. , Universität, Freiburg, verfügbar unter:https://doi.org/10.1002/tee.24035.