Khan, Z., Gururajan, D., Kartmann, S., Koltay, P., Zengerle, R., & Shu, Z. [ca. 2024]. Iterative printing of bulk metal and polymer for additive manufacturing of multi-layer electronic circuits [Cd]. Freiburg: Universität. https://doi.org/10.1038/s44334-024-00001-0
ISO-690 (author-date, English)KHAN, Zeba, GURURAJAN, Dheepesh, KARTMANN, Sabrina, KOLTAY, Peter, ZENGERLE, Roland und SHU, Zhe, 2024. Iterative printing of bulk metal and polymer for additive manufacturing of multi-layer electronic circuits. Freiburg: Universität.
Modern Language Association 9th editionKhan, Z., D. Gururajan, S. Kartmann, P. Koltay, R. Zengerle, und Z. Shu. Iterative printing of bulk metal and polymer for additive manufacturing of multi-layer electronic circuits. cd, Universität, 2024, https://doi.org/10.1038/s44334-024-00001-0.
Mohr Siebeck - Recht (Deutsch - Österreich)Khan, Zeba/Gururajan, Dheepesh/Kartmann, Sabrina/Koltay, Peter/Zengerle, Roland/Shu, Zhe: Iterative printing of bulk metal and polymer for additive manufacturing of multi-layer electronic circuits, Freiburg 2024.
Emerald - HarvardKhan, Z., Gururajan, D., Kartmann, S., Koltay, P., Zengerle, R. und Shu, Z. (2024), Iterative printing of bulk metal and polymer for additive manufacturing of multi-layer electronic circuits, Bd. , Universität, Freiburg, verfügbar unter:https://doi.org/10.1038/s44334-024-00001-0.