Result: Thermal cycling reliability of SnAgCu and SnPb solder joints : A comparison for several IC-packages

Title:
Thermal cycling reliability of SnAgCu and SnPb solder joints : A comparison for several IC-packages
Authors:
VANDEVELDE, Bart, GONZALEZ, Mario, LIMAYE, Paresh, RATCHEV, Petar, BEYNE, Eric
Source:
Microelectronics and reliability. 47(2-3):259-265
Publisher Information:
Oxford: Elsevier, 2007.
Publication Year:
2007
Physical Description:
print, 11 ref
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Assemblage brasage tendre, Soldered joint, Junta soldada, Assemblage circuit intégré, Integrated circuit bonding, Brasage sans plomb, Lead free soldering, Soldeo sin plomo, Contrainte déformation, Stress strain, Tensión deformante, Cycle hystérésis, Hysteresis loop, Ciclo histéresis, Cycle thermique, Thermal cycle, Ciclo térmico, Dissipation énergie, Energy dissipation, Disipación energía, Effet température, Temperature effect, Efecto temperatura, Endommagement, Damaging, Deterioración, Etude comparative, Comparative study, Estudio comparativo, Fiabilité, Reliability, Fiabilidad, Fluage, Creep, Fluencia, Inélasticité, Inelasticity, Inelasticidad, Métal fondu brasage tendre, Solder metal, Metal fundido soldeo blando, Méthode élément fini, Finite element method, Método elemento finito, Packaging électronique, Electronic packaging, Packaging electrónico, Puce à bosses, Flip-chip, Technologie CSP, Chip scale packaging, Vitesse déformation, Strain rate, Velocidad deformación
Document Type:
Conference Conference Paper
File Description:
text
Language:
English
Author Affiliations:
IMEC, Kapeldreef 75, 3001 Leuven, Belgium
ISSN:
0026-2714
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=18518721
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.18518721
Database:
PASCAL Archive

Further Information

This paper deals with a comparison study between SnPb and SnAgCu solder joint reliability. The comparison is based on non-linear finite element modelling. Three packages have been selected: silicon CSP, underfilled flip chip and QFN package. Also the effect of thermal cycling conditions has been investigated. Comparing the induced inelastic strains in the solder joint, the lead-free SnAgCu generally scores better thanks to the lower creep strain rate. On the other hand for the CSP and flip chip package, SnAgCu scores worse for the more extreme loading conditions when the inelastic dissipated energy density is selected as damage parameter. The main reason is that due to the lower creep strain rate, the stresses become higher for SnAgCu resulting in higher hysteresis loops with more dissipated energy per cycle. For the QFN package, SnAgCu scores much better.