VANDEVELDE, B., GONZALEZ, M., LIMAYE, P., RATCHEV, P., & BEYNE, E. (2007, Januar 1). Thermal cycling reliability of Sn Ag Cu and Sn Pb solder joints : A comparison for several IC-packages. 47(2-3). Oxford: Elsevier, 2007. Abgerufen von http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18518721
ISO-690 (author-date, English)VANDEVELDE, Bart, GONZALEZ, Mario, LIMAYE, Paresh, RATCHEV, Petar und BEYNE, Eric, 2007. Thermal cycling reliability of Sn Ag Cu and Sn Pb solder joints : A comparison for several IC-packages. In: [online]. Oxford: Elsevier, 2007. 1 Januar 2007. Available from: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18518721
Modern Language Association 9th editionVANDEVELDE, B., M. GONZALEZ, P. LIMAYE, P. RATCHEV, und E. BEYNE. Thermal cycling reliability of Sn Ag Cu and Sn Pb solder joints : A comparison for several IC-packages. Nr. 2-3, Oxford: Elsevier, 2007., 2007, http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18518721.
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VANDEVELDE, B., GONZALEZ, M., LIMAYE, P., RATCHEV, P. und BEYNE, E. (2007), „Thermal cycling reliability of Sn Ag Cu and Sn Pb solder joints : A comparison for several IC-packages“, in , Bd. 47, Oxford: Elsevier, 2007., verfügbar unter: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18518721.