Result: Numerical modeling of warpage induced in QFN array molding process

Title:
Numerical modeling of warpage induced in QFN array molding process
Authors:
YANG, D. G, JANSEN, K. M. B, ERNST, L. J, ZHANG, G. Q, VAN DRIEL, W. D, BRESSERS, H. J. L, JANSSEN, J. H. J
Source:
Microelectronics and reliability. 47(2-3):310-318
Publisher Information:
Oxford: Elsevier, 2007.
Publication Year:
2007
Physical Description:
print, 9 ref
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Circuits intégrés, Integrated circuits, Conception. Technologies. Analyse fonctionnement. Essais, Design. Technologies. Operation analysis. Testing, Calorimétrie différentielle balayage, Differential scanning calorimetry, Análisis calorimétrico barrido exploración, Durcissement, Hardening, Endurecimiento, Gauchissement, Warping, Torcimiento, Gestion température packaging électronique, Thermal management (packaging), Modélisation, Modeling, Modelización, Méthode numérique, Numerical method, Método numérico, Méthode élément fini, Finite element method, Método elemento finito, Packaging électronique, Electronic packaging, Packaging electrónico, Polymère, Polymer, Polímero, Relaxation, Relajación, Système refroidissement, Cooling system, Sistema enfriamiento, Temps relaxation, Relaxation time, Tiempo relajación
Document Type:
Conference Conference Paper
File Description:
text
Language:
English
Author Affiliations:
Delft University of Technology, Mekelweg 2, 2628 CD Delft, Netherlands
Philips Semiconductors, P. O. Box 30008, 6534 AE Nijmegen, Netherlands
ISSN:
0026-2714
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=18518728
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.18518728
Database:
PASCAL Archive

Further Information

Warpage is a critical issue for QFN array molding process. In this paper, a cure-dependent viscoelastic constitutive model is established to model the cure-induced warpage in array molding process. For the relaxation modulus functions of the packaging polymer, the equilibrium moduli are modeled with a model based on scaling analysis and the relaxation behavior of the transient part is described by the cure-dependent relaxation amplitude and reduced relaxation times which are based on the time-conversion superposition principle. The cure-dependent parameters are characterized by using an integrated approach of dynamical mechanical analysis (DMA) and differential scanning calorimetry (DSC) measurements. Finite element modeling is carried out for three configurations of a carrier package map mould and the warpage induced during the curing process and cooling down is predicted. The results show that warpage induced during the curing process has significant contribution on the total warpage of the map.