Result: Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique

Title:
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique
Authors:
LEE, W. S, HAN, I. Y, JIN YU, KIM, S. J, BYUN, K. Y
Source:
6th symposium of the Korean Society of thermophysical propertiesThermochimica acta. 455(1-2):148-155
Publisher Information:
Amsterdam: Elsevier Science, 2007.
Publication Year:
2007
Physical Description:
print, 12 ref
Original Material:
INIST-CNRS
Subject Terms:
General chemistry, physical chemistry, Chimie générale, chimie physique, Metallurgy, welding, Métallurgie, soudage, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Divers, Miscellaneous, Capacité calorifique, Heat capacity, Capacidad calorífica, Capteur température, Temperature sensor, Sensor temperatura, Coefficient dilatation thermique, Thermal expansion coefficient, Coeficiente dilatación térmica, Conductivité thermique, Thermal conductivity, Conductividad térmica, Densité, Density, Densidad, Diamant, Diamond, Diamante, Diffusivité thermique, Thermal diffusivity, Difusibilidad térmica, Microscopie électronique balayage, Scanning electron microscopy, Microscopía electrónica barrido, Microélectronique, Microelectronics, Microelectrónica, Morphologie, Morphology, Morfología, Packaging électronique, Electronic packaging, Packaging electrónico, Propriété rhéologique, Rheological properties, Propiedad reológica, Propriété thermique, Thermal properties, Propiedad térmica, Puce à bosses, Flip-chip, Réseau diode, Diode array, Red diodo, Structure surface, Surface structure, Estructura superficie, Viscosité, Viscosity, Viscosidad, Diode temperature sensor array, Flip-chip package, Underfill
Document Type:
Conference Conference Paper
File Description:
text
Language:
English
Author Affiliations:
Package R&D Center Hynix Semiconductor Inc., San 136-1, Ami-ri, Bubal-eub, Ichon, Kyonggi 467-701, Korea, Republic of
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-dong Yuseong-gu, Daejon 305-701, Korea, Republic of
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-dong Yuseong-gu, Daejon 305-701, Korea, Republic of
ISSN:
0040-6031
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=18642255
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.18642255
Database:
PASCAL Archive

Further Information

The thermal characteristics of thermally conductive underfill in flip-chip package was studied. To enhance the thermal conductivity of underfill, the epoxy was mixed with thermally conductive fillers, such as silica (1.5W/inK), alumina (36 W/mK) or diamond (2000 W/mK). Coefficient of thermal expansion (CTE) was changed by filler and its content and CTE was 28 ppm for 60 wt% silica, 39 ppm for 60 wt% alumina and 24 ppm for 60 wt% diamond. Thermal conductivity was calculated from the measurement of thermal diffusivity, density and specific heat capacity under the various temperature conditions with the various fillers. To investigate thermal characteristics of different underfill, diode temperature sensor array (DTSA) was fabricated, which consisted of 32 x 32 array of diodes (1024 diodes) for temperature measurement and eight heaters for heat source on an 8 mm x 8 mm of silicon surface. The DTSA was packaged by flip-chip packaging method and applied with the same power (0.84 W) for different underfilled packages. Finally, the thermal simulations with ICEPAK matched very well with the measurement.