LEE, W. S., HAN, I. Y., JIN YU, KIM, S. J., & BYUN, K. Y. (2007, Januar 1). Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique. 455(1-2). Amsterdam: Elsevier Science, 2007. Abgerufen von http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18642255
ISO-690 (author-date, English)LEE, W. S, HAN, I. Y, JIN YU, KIM, S. J und BYUN, K. Y, 2007. Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique. In: [online]. Amsterdam: Elsevier Science, 2007. 1 Januar 2007. Available from: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18642255
Modern Language Association 9th editionLEE, W. S., I. Y. HAN, JIN YU, S. J. KIM, und K. Y. BYUN. Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique. Nr. 1-2, Amsterdam: Elsevier Science, 2007., 2007, http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18642255.
Mohr Siebeck - Recht (Deutsch - Österreich)Emerald - Harvard
LEE, W.S., HAN, I.Y., JIN YU, KIM, S.J. und BYUN, K.Y. (2007), „Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique“, in , Bd. 455, Amsterdam: Elsevier Science, 2007., verfügbar unter: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18642255.