Result: Thermal imprint lithography using sub-micron sized nickel template coated with thin SiO2 layer
Title:
Thermal imprint lithography using sub-micron sized nickel template coated with thin SiO2 layer
Authors:
Source:
Proceedings of the 32nd International Conference on Micro- and Nano-Engineering, Barcelona, 17-20 September 2006Microelectronic engineering. 84(5-8):1003-1006
Publisher Information:
Amsterdam: Elsevier Science, 2007.
Publication Year:
2007
Physical Description:
print, 10 ref
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Electronique des semiconducteurs. Microélectronique. Optoélectronique. Dispositifs à l'état solide, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Fabrication microélectronique (technologie des matériaux et des surfaces), Microelectronic fabrication (materials and surfaces technology), Couche autoassemblée, Self-assembled layer, Capa autoensamblada, Couche mince, Thin film, Capa fina, Couche superficielle, Surface layer, Capa superficial, Durabilité, Durability, Durabilidad, Electroformage, Electroforming, Electroformación, Fabrication microélectronique, Microelectronic fabrication, Fabricación microeléctrica, Fiabilité, Reliability, Fiabilidad, Lithographie, Lithography, Litografía, Matériau revêtu, Coated material, Material revestido, Nanolithographie, Nanolithography, Polymère, Polymer, Polímero, Revêtement, Coatings, Revestimiento, Thermoplastique, Thermoplastics, Termoplástica, Anti-sticking coating, Nanoimprint lithography, Nickel template, Silane based SAM
Document Type:
Conference
Conference Paper
File Description:
text
Language:
English
Author Affiliations:
Department of Materials Science and Engineering, Korea University, Anam-dong 5-1, Sungbuk-Ku, Seoul 136-701, Korea, Republic of
ISSN:
0167-9317
Rights:
Copyright 2007 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.18807362
Database:
PASCAL Archive
Further Information
Nickel template is very suitable for thermal imprinting process since it has high mechanical durability and can easily be duplicated using electroforming technique. However nickel has a poor anti-sticking property; in addition, proper and stable releasing layer on nickel surface is not yet available. In this study, thin layer of SiO2 film was deposited on nickel surface and silane based hydrophobic self-assembled monolayer (SAM) was formed on SiO2 film, coated on nickel. Since the silane based SAM layer can be stably formed on SiO2 layer coated nickel template, it can be used anti-sticking layer for thermal imprint process using thermoplastic polymer resin or thermally curable prepolymer resin.