• Optimization of Multilayer Pro...

Result: Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm

Title:
Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm
Authors:
LIU, De-Shin, CHANG, Chi-Min, TU, Chin-Yi, LIU, An-Hong, HUANG, Cheng-Fang, LEE, Yi-Chang
Source:
IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 1(7-8):1292-1302
Publisher Information:
Piscataway, NJ: Institute of Electrical and Electronics Engineers, 2011.
Publication Year:
2011
Physical Description:
print, 16 ref
Original Material:
INIST-CNRS
Subject Terms:
Electronics, Electronique, Sciences exactes et technologie, Exact sciences and technology, Sciences appliquees, Applied sciences, Electronique, Electronics, Généralités (incluant les aspects économiques et industriels), General (including economical and industrial fields), Algorithme, Algorithm, Algoritmo, Contrainte contact, Contact stress, Tensión contacto, Evaluation performance, Performance evaluation, Evaluación prestación, Industrie électronique, Electronics industry, Industria electrónica, Multicouche, Multiple layer, Capa múltiple, Méthode analytique, Analytical method, Método analítico, Méthode numérique, Numerical method, Método numérico, Méthode élément fini, Finite element method, Método elemento finito, Optimisation, Optimization, Optimización, Pastille électronique, Wafer, Pastilla electrónica, Programmation multiobjectif, Multiobjective programming, Programación multiobjetivo, Castigliano's theorem, energy method, epoxy ring probe card, finite element method, wafer-level probing test
Document Type:
Academic journal Article
File Description:
text
Language:
English
Author Affiliations:
Department of Mechanical Engineering, National Chung Cheng University, Chiayi 621, Tawain, Province of China
ChipMOS Technologies Inc., Tainan 744, Tawain, Province of China
ISSN:
2156-3950
Access URL:
http://pascal-francis.inist.fr/vibad/index.php?action=search&terms=24473480
Rights:
Copyright 2015 INIST-CNRS
CC BY 4.0
Sauf mention contraire ci-dessus, le contenu de cette notice bibliographique peut être utilisé dans le cadre d’une licence CC BY 4.0 Inist-CNRS / Unless otherwise stated above, the content of this bibliographic record may be used under a CC BY 4.0 licence by Inist-CNRS / A menos que se haya señalado antes, el contenido de este registro bibliográfico puede ser utilizado al amparo de una licencia CC BY 4.0 Inist-CNRS
Notes:
Electronics
Accession Number:
edscal.24473480
Database:
PASCAL Archive

Further Information

Wafer testing in the semiconductor industry is generally performed using a multilayer probe card. In this paper, Castigliano's second theorem is used to derive analytical formulae for the contact force and scrub mark length generated during the probing test. The formulations are then integrated with a multiobjective programming algorithm to optimize the probe needle parameters in such a way as to ensure a uniform contact force and a minimum scrub mark length. The validity of the analytical model is confirmed by comparing the solutions obtained for the contact force and scrub mark length with the equivalent results obtained from finite element simulations. The effectiveness of the analytical model and optimization procedure is demonstrated by optimizing the needle parameters of a commercial four-layer probe card. It is shown that the optimized probe card not only produces a more uniform contact force than the original probe card but also yields a shorter and more uniform scrub mark length.