STEEN, S. E., LATULIPE, D., TOPOL, A. W., FRANK, D. J., BELOTE, K., & POSILLICO, D. (2007, January 1). Overlay as the key to drive wafer scale 3 D integration. 84(5-8). Amsterdam: Elsevier Science, 2007. Retrieved from http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18807457
ISO-690 (author-date, English)STEEN, Steven E, LATULIPE, Douglas, TOPOL, Anna W, FRANK, David J, BELOTE, Kevin and POSILLICO, Dominick, 2007. Overlay as the key to drive wafer scale 3 D integration. In: [online]. Amsterdam: Elsevier Science, 2007. 1 January 2007. Available from: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18807457
Modern Language Association 9th editionSTEEN, S. E., D. LATULIPE, A. W. TOPOL, D. J. FRANK, K. BELOTE, and D. POSILLICO. Overlay as the key to drive wafer scale 3 D integration. no. 5-8, Amsterdam: Elsevier Science, 2007., 2007, http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18807457.
Mohr Siebeck - Recht (Deutsch - Österreich)Emerald - Harvard
STEEN, S.E., LATULIPE, D., TOPOL, A.W., FRANK, D.J., BELOTE, K. and POSILLICO, D. (2007), “Overlay as the key to drive wafer scale 3 D integration”, in , Vol. 84, Amsterdam: Elsevier Science, 2007., available at: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18807457.