CHEW, A., HING HO AU, HAN, S. H., NEO, T. L., TAN, J., CHAI, K. W., & CHUA, S. (2007, January 1). Watermark-induced High-density via failures in submicron CMOS fabrication (May 2006). 20(3). New York, NY: Institute of Electrical and Electronics Engineers, 2007. Retrieved from http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18990963
ISO-690 (author-date, English)CHEW, Alex, HING HO AU, HAN, S. H, NEO, T. L, TAN, Jackson, CHAI, K. W and CHUA, Samuel, 2007. Watermark-induced High-density via failures in submicron CMOS fabrication (May 2006). In: [online]. New York, NY: Institute of Electrical and Electronics Engineers, 2007. 1 January 2007. Available from: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18990963
Modern Language Association 9th editionCHEW, A., HING HO AU, S. H. HAN, T. L. NEO, J. TAN, K. W. CHAI, and S. CHUA. Watermark-induced High-density via failures in submicron CMOS fabrication (May 2006). no. 3, New York, NY: Institute of Electrical and Electronics Engineers, 2007., 2007, http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18990963.
Mohr Siebeck - Recht (Deutsch - Österreich)Emerald - Harvard
CHEW, A., HING HO AU, HAN, S.H., NEO, T.L., TAN, J., CHAI, K.W. and CHUA, S. (2007), “Watermark-induced High-density via failures in submicron CMOS fabrication (May 2006)”, in , Vol. 20, New York, NY: Institute of Electrical and Electronics Engineers, 2007., available at: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18990963.