SUGANO, M., NAKAMURA, T., SHIKIMACHI, K., HIRANO, N., & NAGAYA, S. (2007, Januar 1). Stress tolerance and fracture mechanism of solder joint of YBCO coated conductors. 17(2). New York, NY: Institute of Electrical and Electronics Engineers, 2007. Abgerufen von http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=19016948

SUGANO, Michinaka, NAKAMURA, Taketsune, SHIKIMACHI, Koji, HIRANO, Naoki und NAGAYA, Shigeo, 2007. Stress tolerance and fracture mechanism of solder joint of YBCO coated conductors. In: [online]. New York, NY: Institute of Electrical and Electronics Engineers, 2007. 1 Januar 2007. Available from: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=19016948

SUGANO, M., T. NAKAMURA, K. SHIKIMACHI, N. HIRANO, und S. NAGAYA. Stress tolerance and fracture mechanism of solder joint of YBCO coated conductors. Nr. 2, New York, NY: Institute of Electrical and Electronics Engineers, 2007., 2007, http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=19016948.

SUGANO, M., NAKAMURA, T., SHIKIMACHI, K., HIRANO, N. und NAGAYA, S. (2007), „Stress tolerance and fracture mechanism of solder joint of YBCO coated conductors“, in , Bd. 17, New York, NY: Institute of Electrical and Electronics Engineers, 2007., verfügbar unter: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=19016948.