SUGANO, M., NAKAMURA, T., SHIKIMACHI, K., HIRANO, N., & NAGAYA, S. (2007, January 1). Stress tolerance and fracture mechanism of solder joint of YBCO coated conductors. 17(2). New York, NY: Institute of Electrical and Electronics Engineers, 2007. Retrieved from http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=19016948
ISO-690 (author-date, English)SUGANO, Michinaka, NAKAMURA, Taketsune, SHIKIMACHI, Koji, HIRANO, Naoki and NAGAYA, Shigeo, 2007. Stress tolerance and fracture mechanism of solder joint of YBCO coated conductors. In: [online]. New York, NY: Institute of Electrical and Electronics Engineers, 2007. 1 January 2007. Available from: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=19016948
Modern Language Association 9th editionSUGANO, M., T. NAKAMURA, K. SHIKIMACHI, N. HIRANO, and S. NAGAYA. Stress tolerance and fracture mechanism of solder joint of YBCO coated conductors. no. 2, New York, NY: Institute of Electrical and Electronics Engineers, 2007., 2007, http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=19016948.
Mohr Siebeck - Recht (Deutsch - Österreich)Emerald - Harvard
SUGANO, M., NAKAMURA, T., SHIKIMACHI, K., HIRANO, N. and NAGAYA, S. (2007), “Stress tolerance and fracture mechanism of solder joint of YBCO coated conductors”, in , Vol. 17, New York, NY: Institute of Electrical and Electronics Engineers, 2007., available at: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=19016948.