Yang, J., Liu, D., Kinshuk, Tlili, A., Chang, M., Popescu, E., Burgos, D., Altinay, Z., Yang, J., Liu, D., Kinshuk, Tlili, A., Chang, M., Popescu, E., Burgos, D., & Altinay, Z. (2022). Resilience and Future of Smart Learning: Proceedings of 2022 International Conference on Smart Learning Environments. Lecture Notes in Educational Technology. https://doi.org/10.1007/978-981-19-5967-7
ISO-690 (author-date, English)YANG, Junfeng, LIU, Dejian, KINSHUK, TLILI, Ahm, CHANG, Maiga, POPESCU, Elvira, BURGOS, Daniel, ALTINAY, Zehra, YANG, Junfeng, LIU, Dejian, KINSHUK, TLILI, Ahm, CHANG, Maiga, POPESCU, Elvira, BURGOS, Daniel und ALTINAY, Zehra, 2022. Resilience and Future of Smart Learning: Proceedings of 2022 International Conference on Smart Learning Environments. Lecture Notes in Educational Technology. ISBN 978-981-19596-6-0.
Modern Language Association 9th editionYang, J., D. Liu, Kinshuk, A. Tlili, M. Chang, E. Popescu, D. Burgos, Z. Altinay, J. Yang, D. Liu, Kinshuk, A. Tlili, M. Chang, E. Popescu, D. Burgos, und Z. Altinay. Resilience and Future of Smart Learning: Proceedings of 2022 International Conference on Smart Learning Environments. Lecture Notes in Educational Technology. 2022, https://doi.org/10.1007/978-981-19-5967-7.
Mohr Siebeck - Recht (Deutsch - Österreich)Yang, Junfeng/Liu, Dejian/Kinshuk/Tlili, Ahm/Chang, Maiga/Popescu, Elvira u. a.: Resilience and Future of Smart Learning: Proceedings of 2022 International Conference on Smart Learning Environments. Lecture Notes in Educational Technology, 2022.
Emerald - HarvardYang, J., Liu, D., Kinshuk, Tlili, A., Chang, M., Popescu, E., Burgos, D., Altinay, Z., Yang, J., Liu, D., Kinshuk, Tlili, A., Chang, M., Popescu, E., Burgos, D. und Altinay, Z. (2022), Resilience and Future of Smart Learning: Proceedings of 2022 International Conference on Smart Learning Environments. Lecture Notes in Educational Technology, Bd. , verfügbar unter:https://doi.org/10.1007/978-981-19-5967-7.