Result: White X-ray beam topography and radiography of Si1-xGex crystals bonded to silicon
X-ray Imaging Center, Department of Materials Science and Engineering, Pohang University of Science and Technology, San 31 Hyoja-dong, Namku, Pohang, 790-784, Korea, Republic of
Institute of Problems of Mechanical Engineering, Russian Academy of Sciences, Bolshoy 61, Vasil. Ostrov, 199178 St. Petersburg, Russian Federation
Institute of Crystal Growth, 12489 Berlin, Germany
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Further Information
The defect structure of Si1-xGex wafers with 4% of germanium and their interfaces with Si wafers were studied using white radiation topography and phase-sensitive radiography. The heterostructures were manufactured by direct bonding of Si1-xGex and Si crystalline wafers made of bulk crystals that were grown by the Czochralski technique. In Si1-xGex crystals, the segregations of Ge act as dislocation nucleation sites. In Si1-xGex/Si bonded structures, the segregation of Ge as well as the accumulation of dislocations induce elastic strain and plastic deformation during high-temperature bonding annealing. With the topography-radiography combination, we are able not only to detect microcracks, indicating nonbonded areas, by radiography, but also to reveal dislocations and long-range strain fields by topography at the same time.