American Psychological Association 6th edition

JIANZHENG HU, LIANQIAO YANG, & MOO WHAN SHIN. (2007, January 1). Mechanism and thermal effect of delamination in light-emitting diode packages. 38(2). Oxford: Elsevier Science, 2007. Retrieved from http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18522862

ISO-690 (author-date, English)

JIANZHENG HU, LIANQIAO YANG and MOO WHAN SHIN, 2007. Mechanism and thermal effect of delamination in light-emitting diode packages. In: [online]. Oxford: Elsevier Science, 2007. 1 January 2007. Available from: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18522862

Modern Language Association 9th edition

JIANZHENG HU, LIANQIAO YANG, and MOO WHAN SHIN. Mechanism and thermal effect of delamination in light-emitting diode packages. no. 2, Oxford: Elsevier Science, 2007., 2007, http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18522862.

Mohr Siebeck - Recht (Deutsch - Österreich)

Emerald - Harvard

JIANZHENG HU, LIANQIAO YANG and MOO WHAN SHIN. (2007), “Mechanism and thermal effect of delamination in light-emitting diode packages”, in , Vol. 38, Oxford: Elsevier Science, 2007., available at: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18522862.

Warning: These citations may not always be 100% accurate.