TEO, J. W. R., LI, G. Y., LING, M. S., WANG, Z. F., & SHI, X. Q. (2007, January 1). Parametric investigation of laser diode bonding using eutectic Au Sn solder. 515(10). Lausanne: Elsevier Science, 2007. Retrieved from http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18618620
ISO-690 (author-date, English)TEO, J. W. Ronnie, LI, G. Y, LING, M. S, WANG, Z. F and SHI, X. Q, 2007. Parametric investigation of laser diode bonding using eutectic Au Sn solder. In: [online]. Lausanne: Elsevier Science, 2007. 1 January 2007. Available from: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18618620
Modern Language Association 9th editionTEO, J. W. R., G. Y. LI, M. S. LING, Z. F. WANG, and X. Q. SHI. Parametric investigation of laser diode bonding using eutectic Au Sn solder. no. 10, Lausanne: Elsevier Science, 2007., 2007, http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18618620.
Mohr Siebeck - Recht (Deutsch - Österreich)Emerald - Harvard
TEO, J.W.R., LI, G.Y., LING, M.S., WANG, Z.F. and SHI, X.Q. (2007), “Parametric investigation of laser diode bonding using eutectic Au Sn solder”, in , Vol. 515, Lausanne: Elsevier Science, 2007., available at: http://pascal-francis.inist.fr/vibad ndex.php?action=search&terms=18618620.